Removal and replacement procedures 49
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o Extend the server from the rack (on page 29).
3. Remove the access panel ("Access panel" on page 31).
4. Remove the processor air baffle ("Processor air baffle" on page 43).
5. Remove a memory board ("Memory board" on page 48).
6. Remove the FBDIMM.
To replace the component, reverse the removal procedure.
Processor
CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or
cache sizes. Refer to the label on the processor heatsink for a description of the processor.
CAUTION: To prevent a possible server malfunction during POST, be sure to install the most
current version of the system ROM before installing, upgrading, or replacing a processor. For the
most current version of the system ROM, go to the HP website (http://www.hp.com/support).
CAUTION: To avoid damage to the system board:
• Do not touch the processor socket contacts.
• Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.
CAUTION: To avoid damage to the processor:
• Handle the processor only by the edges.
• Do not touch the bottom of the processor, especially the contact area.
IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the
server does not power up.
To remove the component:
1. Power down the server (on page 29).
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