Removal and replacement procedures 48
For maximum performance, HP recommends that both memory boards be populated with the same total
amount of memory to support 4x1 interleaving across both memory branches.
Observe the following warnings when performing a replacement procedure:
WARNING: Always comply with all electrostatic and thermal guidelines to prevent bodily injury
and ensure a properly functioning system when performing hot-plug operations.
WARNING: To prevent personal injury from hazardous energy:
• Remove watches, rings, or other metal objects.
• Use tools with insulated handles.
• Do not place tools or metal parts on top of batteries.
Memory board
To remove the component:
1. Power down the server (on page 29).
2. Do one of the following:
o Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o Extend the server from the rack (on page 29).
3. Remove the access panel ("Access panel" on page 31).
4. Remove the processor air baffle ("Processor air baffle" on page 43).
5. Remove the memory board and place it on a flat surface.
To replace the component, reverse the removal procedure.
FBDIMM
To remove the component:
1. Power down the server (on page 29).
2. Do one of the following:
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