EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Screwdiver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Removed Stand base
2. Removed Rear Cover
3. Removed Hinge
4. Removed Converter board & others
5. Removed HDD module
6. Remove MB Shielding
7. Removed Thermal module
8. Removed Fan module
9. Removed Base pan
10. Removed MB
11. Removed Speaker module
12. Removed Camera module
13. Removed Speaker Grill
14. Removed LCD panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed Stand base
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