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HP ProOne 440 G3 User Manual

HP ProOne 440 G3
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EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProOne 440 G3 Non-Touch All-in-One Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Motherboard, RAM*2, Transform board
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
EPS and power cord
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
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HP ProOne 440 G3 Specifications

General IconGeneral
Operating SystemWindows 10 Pro
Memory Speed2133 MHz
ProcessorIntel Core i3/i5/i7 (6th/7th Gen)
RAMUp to 32GB DDR4
Display23.8 inch FHD
GraphicsIntel HD Graphics 530
PortsUSB 3.0, USB 2.0, HDMI, Ethernet, headphone/microphone combo jack
AudioIntegrated stereo speakers, dual array microphone
NetworkingEthernet, Wi-Fi
Power Supply90W
Weight5.4 kg

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Components with a surface greater than 10 sq cm like Motherboard, RAM, Transform board.

Batteries

Includes alkaline and lithium coin or button style batteries, and RTC batteries.

Mercury-containing components

Components containing mercury, e.g., lamps, display backlights, scanner lamps, switches.

Liquid Crystal Displays (LCD)

Displays with a surface greater than 100 sq cm, including backlit LCDs with gas discharge lamps.

Capacitors / condensers

Includes PCB/PCT capacitors and electrolytic types over 2.5 cm in diameter or height.

External electrical cables and cords

Includes EPS and power cord.

Gas Discharge Lamps

Gas discharge lamps.

Plastics containing Brominated Flame Retardants

Plastics weighing > 25 grams not including PCBs or PCAs.

Components with toner and ink

Parts with toner/ink, liquids, gels, pastes; includes cartridges, print heads, tubes.

Components and waste containing asbestos

Components and waste containing asbestos.

Components with refractory ceramic fibers

Components, parts and materials containing refractory ceramic fibers.

Components with radioactive substances

Components, parts and materials containing radioactive substances.

Tools Required

Screwdriver

Screwdriver with TORX T8 size for disassembly.

Product Disassembly Process

Step 1: Removed Stand base

First step in disassembly is removing the stand base.

Step 2: Removed Rear Cover

Second step involves removing the rear cover of the product.

Step 3: Removed Hinge

Third step is the removal of the hinge mechanism.

Step 4: Removed Converter board & others

Fourth step is removing the converter board and related components.

Step 5: Removed HDD module

Fifth step is the removal of the Hard Disk Drive module.

Step 6: Removed MB Shielding

Sixth step is removing the Motherboard (MB) shielding.

Step 7: Removed Thermal module

Seventh step is removing the thermal module.

Step 8: Removed Fan module

Eighth step is removing the fan module.

Step 9: Removed Base pan

Ninth step is removing the base pan.

Step 10: Removed MB

Tenth step is removing the Motherboard (MB).

Step 11: Removed Speaker module

Eleventh step is removing the speaker module.

Step 12: Removed Camera module

Twelfth step is removing the camera module.

Step 13: Removed Speaker Grill

Thirteenth step is removing the speaker grill.

Step 14: Removed LCD panel

Fourteenth step is removing the LCD panel.

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