EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on a flat, soft and clean surface.
2. Unscrew the screws to remove the stand-assy.
3. Remove the tapes
4. Remove the screws
5. Remove the connectors and key board.
6. Unscrew the screws, Remove the mainframe.
7. Remove the screws in the red to remove the main board and power board
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Pls. refer to the attachment:
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