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HP X2 210 G2 User Manual

HP X2 210 G2
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Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
When seated, wear a wrist strap connected to a grounded system. Wrist straps are exible straps with a
minimum of one megohm ±10% resistance in the ground cords. To provide proper ground, wear a strap
snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips
to connect a wrist strap.
When standing, use foot straps and a grounded oor mat. Foot straps (heel, toe, or boot straps) can be
used at standing workstations and are compatible with most types of shoes or boots. On conductive
oors or dissipative oor mats, use foot straps on both feet with a minimum of one megohm resistance
between the operator and ground. To be
eective, the conductive must be worn in contact with the skin.
The following grounding equipment is recommended to prevent electrostatic damage:
Antistatic tape
Antistatic smocks, aprons, and sleeve protectors
Conductive bins and other assembly or soldering aids
Nonconductive foam
Conductive tabletop workstations with ground cords of one megohm resistance
Static-dissipative tables or oor mats with hard ties to the ground
Field service kits
Static awareness labels
Material-handling packages
Nonconductive plastic bags, tubes, or boxes
Metal tote boxes
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and oor mats.
Material Use Voltage protection level
Antistatic plastics Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
Grounding guidelines 21

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HP X2 210 G2 Specifications

General IconGeneral
Form factorConvertible (Detachable)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SteppingC0
Tjunction90 °C
Processor cache2 MB
Processor cores4
Processor familyIntel Atom®
Processor seriesIntel Atom x5 Series
Processor socketBGA 592
Processor codenameCherry Trail
Processor frequency1.44 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency1.84 GHz
Processor operating modes64-bit
PCI Express configurations1x1
Scenario Design Power (SDP)2 W
Maximum number of PCI Express lanes1
Numeric keypadNo
Pointing deviceTouchpad
Full-size keyboardYes
Internal memory2 GB
Internal memory typeDDR3L-SDRAM
Memory layout (slots x size)1 x 2 GB
Storage mediaeMMC
Total storage capacity32 GB
Compatible memory cardsMicroSD (TransFlash)
Display diagonal10.1 \
Touch technologyMulti-touch
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Number of execution units12
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency200 MHz
On-board graphics card dynamic frequency (max)500 MHz
Battery capacity32.5 Wh
Number of battery cells2
AC adapter power45 W
Audio decodersDTS Studio Sound
Rear camera resolution (numeric)5 MP
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Sustainability certificatesEPEAT Silver, ENERGY STAR
Processor codeSR29Z
Processor ARK ID87383
Processor package size17 x 17 mm
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth170 mm
Width265 mm
Height16.2 mm
Weight1090 g
Height (tablet mode)9.2 mm
Weight (tablet mode)580 g

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