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HP xw8600

HP xw8600
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QuickSpecs
HP xw8600 Workstation
Technical Specifications - Input/Output Devices
DA 12849 Worldwide Version 10 June 1, 2008 Page 49
CD-ROM drive
Built in sound system
Available PCI slot
Regulatory Agency
Approval
FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-
1998 STD, Taiwan BSMI CNS13438, Korea MIC
Keys
104, 105, 106, 107, 109 layout
(depending upon country)
Dimensions (L x W x
H)
18.0 x 6.4 x 0.98 inches; 45.8 x 16.3 x
2.5 cm
Physical
characteristics
Weight
2 lb (0.9 kg) minimum
Operating voltage
+ 5VDC ± 5%
Power consumption
50-mA maximum (with three LEDs ON)
ESD
CE level 4, 15-kV air discharge
EMI - RFI
Conforms to FCC rules for a Class B
computing device
Electrical
MicrosoftPC 99 -
2001
Functionally compliant
Languages
38 available
Keycaps
Low-profile design
Switch actuation
55-g nominal peak force with tactile
feedback
Switch life
20 million keystrokes (using Hasco modified
tester)
Switch type
Contamination-resistant switch membrane
Key-leveling
mechanisms
For all double-wide and greater-length keys
Cable length
6 feet; 1.8 m
Microsoft PC 99 -
2001
Mechanically compliant
Mechanical
Acoustics
43-dBA maximum sound pressure level
Operating
temperature
50° to 122° F (10° to 50° C)
Non-operating
temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating
humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating
shock
80 g, six surfaces
PS/2 OR
USB Standard
Keyboard
Environmental
Operating vibration
2-g peak acceleration

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