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MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Torx screwdriver

TT8

Description #2 Torx screwdriver

PH1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Using TT8 screwdriver to remove 4 screws on the chassis.

2. Remove the upper cover.

3. Using PH1 screwdriver, remove 2 screws from PCBA.

4. Remove PCBA.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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HPE AP22 Specifications

General