Doc. Title
Dream Service Manual
Page 109 of 113
HTC CONFIDENTIAL
HTC Corporation
9.2. Board Level 2.5 Repairs
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
arning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged
Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3 It has to wait the temperature cool down before the damaged components been removed. Or, the
others components could be gone when the solder-proof tape been taken off.
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A. Checking the polarity of CON5、CON6、CON7、CON8、CON10, and the position can't be shifted.
B. Checking the polarity of CON7、CON8, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
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