Huawei MU609 - Customer PCB Design; PCB Pad Design

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Mechanical Specifications Compatibility
Design Guide
Issue 08 (2016-12-12)
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
49
Figure 3-1 Dimensions of Huawei 30 mm × 30 mm LGA modules (unit: mm)
ME909s-120
MU509
MC509
ME909u
ME209u-526
MU609
MU709
ME909s-821
ME909s-821
ME909s-120
MU709
MU509
MC509
ME909u
ME209u-526
MU609
3.2 Customer PCB Design
3.2.1 PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
Figure 3-2 The footprint design of Huawei 30 mm × 30 mm LGA modules (unit: mm)
MU509-b/MU509-c/MU509-g
/MC509
MU609/ME909u-521
ME209u-526/ME909u-523/MU709
/ME909s/MU509-65