Figure 50. Removing the heat sink
b) Grip the heat sink (B) on opposing sides and remove the heat sink by lifting it upward. Set the heat
sink aside with the module side facing upward.
Note: If you plan to remove dust or debris from the heat sink, this operation must be performed in
another room that is greater than 7.6 m (24.9 ft) away from the work area.
c) Place the heat sink on an appropriate ESD surface.
d) If your system has a second system processor, repeat steps “23.a” on page 51 through “23.c” on
page 52 to remove the other heat sink.
24. Remove the thermal interface material (TIM) from the system processor module or modules:
a) If the system uses the gray-colored TIM: Using the tweezers, remove the gray-colored TIM from
the top of the processor and place it in a clean, dry area as shown in Figure 51 on page 53.
The system can use two types of TIMs. One TIM is silver-colored with trimmed corners and
typically adheres to the heat sink. The other TIM is dark gray with square corners and will lightly
adhere. The gray-colored TIM needs to be removed before the processor is removed.
Note: The gray-colored TIM can be removed using tweezers and reused, but it is best left on the
heat sink during servicing. Be careful not to damage the gray-colored TIM as it is very light and
porous.
52
Power Systems: System backplane
To Next Page
Loading...
Need help?
General
