Figure 54. Removing the system processor module tool
g) Lift the tool off the system processor module.
h) Repeat steps “5.a” on page 48 through “5.g” on page 53 for all of the system processor modules.
6. Install new thermal interface material (TIM) and the new heat sinks in the new system backplane.
a) Open the TIM packaging and carefully remove the TIM, holding it by the edges of the carrier strip
and holding it away from the shipping container.
b) Remove the protective lm from the clear carrier strip by using the supplied tweezers.
Note: The TIM must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
c) Using the tweezers, remove the TIM from the carrier strip and center it onto the system processor
module.
The silver-colored TIM must have the red stripe up. Align the beveled corners of the silver-colored
TIM and the system processor module (A), as shown in the following gure.
Use the alignment marks on the top of the system processor module to properly place the TIM.
You must center the TIM in the alignment marks on the system processor module.
System backplane for the 9040-MR9
53
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