[c-1
INTEGRATED CIRCUITS AND SOLID STATE DEVICES SUCH
AS MOS FET'S, ESPECIALLY CMOS TYPES, ARE
SUS-
CEPTI BLE TO DAMAGE BY ELECTROSTATIC DISCHARGES
RECEIVED FROM IMPROPER HANDLING, THE USE OF
UNGROUNDED TOOLS, AND IMPROPER STORAGE AND
PACKAGING. ANY MAINTENANCE TO THIS UNIT MUST
BE PERFORMED WITH THE FOLLOWING PRECAUTIONS:
1.
BEFORE USING IN A CIRCUIT, KEEP ALL LEADS
SHORTED TOGETHER EITHER BY THE USE OF
VENDOR-SUPPLIED SHORTING SPRINGS OR BY
INSERTING LEADS INTO A CONDUCTIVE MATERIAL.
2.
WHEN REMOVING DEVICES FROM THEIR CONTAINERS,
GROUND THE HAND BEING USED WITH A CONDUC-
TIVE WRISTBAND.
3.
TIPS OF SOLDERING IRONS AND/OR ANY TOOLS
USED
FUST BE GROUNDED.
4.
DEVICES MUST
NEVER BE INSERTED INTO NOR
REMOVED
FROM CIRCUITS
WITH POWER ON.
5.
PC BOARD, WHEN TAKEN OUT OF THE SET, MUST
BE LAID ON A GROUNDED CONDUCTIVE MAT OR
STORED IN A CONDUCTIVE STORAGE BAG.
Remove
any
built-in power source, such
as a battery, before
laying
PC Boards
on conductive mat or storing
in
con-
ducti
ve bag.
6.
PC BOARDS, IF BEING SHIPPED TO THE FACTORY
FOR REPAIR, MUST BE PACKAGED IN A CONDUC-
TIVE BAG AND PLACED IN
A
WELL-CUSHIONED
SHIPPING BOX.
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