THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LM15U_PWR_2_ALL
2014-11-26
25
LM15U
R2508
100K
1/16W
1%
ZD2501
5V
OPT
POWER_ON/OFF2_4
Q2501
2N7002KA
KEC_CORE_DCDC_FET
G
D
S
C2504
10uF
25V
C2501
1uF
10V
C2505
10uF
25V
C2513
10uF
10V
TU_JP
L2500
1.0uH
LPBN8050T-1R0N
CORE_VID1
R2512
220K
1/10W
5%
C2509
22uF
10V
C2502
0.033uF
50V
POWER_ON/OFF2_3
C2508
22uF
10V
C2503
0.1uF
16V
+2.5V_Normal
R2511
430K
1/16W
1%
R2517
0 5%
C2510
0.1uF
16V
TU_JP
R2516
10K
IC2502
TJ4220GDP-ADJ
EAN62206201
TU_JP
3
VIN3
2
EN2
4
NC4
1
NC_1
5
NC_2
6
VOUT
7
ADJ/SENSE
8
GND
9
[EP]GND
ZD2500
2.5V
DCDC_DIODE
L2501
+12V
0.1uF
C2512
TU_JP
Q2500-*1
2N7002K
DIODES_CORE_DCDC_FET
S
D
G
R2507
1K
R2509
33
1/16W
5%
R2510
100
1/16W
1%
C2506
330pF
50V
+3.3V_NORMAL
+1.1V_VDDC
C2500
0.1uF
16V
OPT
+3.3V_NORMAL
C2507
22uF
10V
R2513
10K
TU_JP
R2504
13K
1/16W
1%
R2500
10K
+3.3V_NORMAL
CORE_VID0
Q2500
2N7002KA
KEC_CORE_DCDC_FET
G
D
S
R2501
0 5%
IC2501
MP8762HGLE-Z
3
FB
2
FREQ
4
SS
1
EN
6
PG
5
AGND
7
VCC
8
BST
9
IN_1
10
PGND_1
11
PGND_2
12
PGND_3
13
PGND_4
14
IN_2
15
SW_1
16
SW_2
Q2501-*1
2N7002K
DIODES_CORE_DCDC_FET
S
D
G
R2519
30K
1/16W
1%
R2503
30K
1/16W
1%
R2502
120K
1/16W
1%
R2518
120K
1/16W
1%
R2505
12K
1/16W
1%
R2506
12K
1/16W
1%
R2514
22K
TU_JP
R2515
47K
TU_JP
+2.5V
R2-1
+1.1V or +1.15V _CORE
R1
Vout=0.611*(1+R1/R2)
R2
R1
2A
R2-3
R1:13K/R2:22K, V=0.95V(CORE_VID0=L,CORE_VID1=L) Voltage drop 0.02V
10A
R2
MAX 7A
Vout=0.6*(1+R1/R2)
R2-2
R1:13K/R2:22K//150K, V=1.00V(CORE_VID0=H,CORE_VID1=L) Voltage drop 0.02V
R1:13K/R2:22K//150K, V=1.00V(CORE_VID0=L,CORE_VID1=H) Voltage drop 0.02V
R1:13K/R2:22K//150K//150K, V=1.05V(CORE_VID0=H,CORE_VID1=H) Voltage drop 0.02V
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