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LG GD330 - Getting to Know Your Phone

LG GD330
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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1. General Description
The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a DCXO part. The main RF
Chipset B6PLD is a highly integrated RF transceiver IC FOR Digital Interface of GSM 850,DCS1800 and PCS1900
quad-band cellular systems. The B6PLD incorporates EDGE transceiver capability, quad R low-noise amplifiers
(LNAs). Direct conversion mixers, a programmable gain amplifier(PGA) with DC offset and frequency response
correction, ADC, Digital filter, Digital Interface, fully integrated VCOs, an RF fractional-N synthesizer, a low-noise
offset PLL transmitter, Digital modulator, TXDAC, RAMPDAC, and AFCDAC. The B6PLD includes state machine
control through serial programming. All functions operate down to 2.67V and are housed in a 72-pin BGA
package. Hence the B6PLD can form a small size transceiver handset for quad band EDGE transceiver.
3.2. RF Part
3.2.1 Receiver Part
The B6PLD receiver supports quad band, so the front-end incorporates four LNAs and two mixers. The incoming
RF signals are mixed directly down to I/Q baseband by the front-end block. This incorporates four LNAs/four
buffers and two Gilbert Cell mixer blocks optimized for operation at 850MHz, 900MHz, 1800MHz and 1900MHz
respectively. The front-end block is followed by two closely matched baseband amplifier chains. These include
distributed low pass filtering, one switched gain stage and one fixed gain stage. In addition, the baseband section
integrates A/D and D/A converters which provide automatic on-chip correction of DC offsets.
<Fig.3-1> Receiver Part Block Diagram

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