QUICK START GUIDE FOR DEMONSTRATION CIRCUIT 600
EVALUATION CARD FOR THE LTC1540 IN THE DFN PACKAGE
PACKAGE AND CONNECTION DRAWING
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
0.200 REF
0.00 – 0.05
(DD8) DFN 0902
0.28 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.25 ±0.05
0.50
BSC
0.58 ±0.05
3.35 ±0.05
PACKAGE
OUTLINE
0.28 ± 0.05
0.50 BSC
TOP VIEW
DD PACKAGE
8-LEAD (3mm × 3mm) PLASTIC DFN
5
6
7
8
4
3
2
1GND
V
–
IN
+
IN
–
OUT
V
+
REF
HYST
ASSEMBLY TIPS
−
Activation temperature 130
°
C to 150
°
C Following are the recommended procedures for solder-
ing surface mount packages to PC boards.
−
Reflow begins at 183
°
C (63Sn/37Pb)
Reflow Soldering with Solder Paste
−
Time above 183
°
C for 30 seconds
•
Use of solder plated boards is recommended.
−
Peak package body temperature 220
°
C to 245
°
C
•
Screen solder paste on board.
−
Dwell time at peak temperature 10 seconds max
•
Mount components on board.
−
Cooling rate 2
°
C to 4
°
C per second
•
Infrared or forced hot air convection reflow is rec-
ommended for best performance. Parameters:
−
Clean boards.
•
For Vapor Phase Reflow, recommended parameter
ranges for:
−
Preheat peak temperature 125
°
C
±
15
°
C and 2
°
C
to 4
°
C per second rise
−
Heating rate: 4
°
C per second max
3
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