Linear 600 - User Manual

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QUICK START GUIDE FOR DEMONSTRATION CIRCUIT 600

EVALUATION CARD FOR THE LTC1540 IN THE DFN PACKAGE

LTC1540CDD

DESCRIPTION

Demonstration circuit 600 simplifies the evaluation of

the LTC1540CDD comparator in the tiny, 3mm

3mm,

DFN (

ual in-line,

lat,

o-leads) chip-scale package.

Electrical performance of this LTC1540 is the same as

previous versions. This version is only a packaging en-

hancement.

An evaluation circuit can easily be built on this board

without handling the tiny DFN device. Pads are provided

for adding external components and holes are available

for jumpers, signal I/O and supply wires. Supply bypass

capacitors are already on the board. Alternatively adding

two 4-pin headers (0.1" spacing) converts the board to a

standard 8-pin DIP format for use with a socket on a

second circuit board.

The backside of this evaluation board is void of metal to

allow wiring into an existing system with the board rest-

ing on top of other components.

About the LTC1540CDD

The LTC1540 is a Nano-power Voltage Comparator with

a Built In Voltage Reference



Ultra-low Quiescent Current of only 300nA



1.2V, 2% Tolerance Voltage Reference



Adjustable Hysteresis



sec Propagation Delay



Input Voltage Range From V

to V

-1.3V



Output Sources 40mA



Total Supply Voltage Range: 2V to 11V

Table 1.

Typical Performance Summary (Single 3V Supply, T

=25

C) Visit www.linear.com for complete data sheet.

PARAMETER CONDITION VALUE

Supply Current 280nA

Offset Voltage 12mV

Input Bias Current

10pA

Propagation Delay 10mV Overdrive

100mV overdrive

sec

Output Swing Voltage from Either Supply Rail 400mV

Reference Voltage 1.182V

Device Top Mark Identifier: LAAS

Need help?

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Summary

Description

About the LTC1540 CDD

Details the LTC1540 Nano-power Voltage Comparator features and specifications.

Quick Start Procedure

Package and Connection Drawing

Assembly Tips

Rework Guidelines for DFN Packages

Reflow Temperature Profile

Establishing reflow temperature profiles using hot gas tools and thermocouples.

Preheating and Package Removal

Procedure for preheating the PCB and removing the package using specialized tools.

Site Rework

Steps for cleaning the site and removing solder residues for reattachment.

Solder Paste Application

Guidelines for applying solder paste using stencils or direct application.

Reflow Process

Steps for reflowing the replacement package using hot gas tools and PCB heaters.