Do you have a question about the Marvell ARMADA 88F6810 and is the answer not in the manual?
Identifies the specific Marvell devices for which this document is relevant.
Lists other documents containing additional information for the specified devices.
Provides a 4-layer PCB stack-up example for impedance matching.
Offers general trace routing and board design guidelines for 5 mil traces.
Discusses power filtering requirements for analog power pins.
Explains insertion loss and loss budget concepts for high-speed serial interfaces.
Defines Inter-Symbol Interference and its impact on eye patterns.
Details parameters for selecting PCB materials for high-speed interfaces.
Discusses crosstalk phenomena and its impact on signal integrity.
Emphasizes the importance of a continuous return current path for signal quality.
Provides guidelines for achieving target differential and single-ended impedances.
Addresses capacitive discontinuities and their effect on insertion loss.
Details via structures and their impact on signal integrity.
Covers power network design, loop inductance, and decoupling capacitors.
Provides guidelines for analog power filtering and decoupling capacitors.
Addresses core power decoupling requirements and implementation notes.
Details I/O power bypassing, focusing on return path continuity.
Recommends bulk capacitance for power polygons and resonance suppression.
Provides layout recommendations for VTT termination voltage.
Describes DDR3 SDRAM interface signals and their connection to devices.
Provides layout guidelines for 16-bit SDRAM DDR3 signals.
Details ODT control matrix and driver configuration for DDR3.
Describes DDR3 SDRAM interface signals and their connection to devices.
Provides layout guidelines for 32-bit SDRAM DDR3 signals.
Describes DDR4 SDRAM interface signals and their connection to devices.
Provides layout guidelines for 32-bit SDRAM DDR4 signals.
Details RGMII interface signal groups and connectivity.
Provides routing constraints and topologies for RGMII interface.
Details SGMII interface signal groups and connectivity.
Provides routing constraints for SGMII chip-to-chip connections.
Details HS-SGMII interface signal groups and connectivity.
Provides routing constraints for HS-SGMII interfaces.
Details QSGMII interface signal groups and connectivity.
Provides routing constraints for QSGMII chip-to-chip connections.
Describes PCIe 1.0/1.1 interface signal groups and connectivity.
Provides layout guidelines for PCIe 1.0/1.1 signals.
Describes PCIe 2.0 interface signal groups and connectivity.
Provides layout guidelines for PCIe 2.0 signals.
Details USB 2.0 interface pin connectivity groups.
Provides USB 2.0 routing constraints and topologies.
Discusses design considerations for USB 3.0 host or device.
Details USB 3.0 interface pin connectivity groups.
Describes SATA 3.0 interface signal groups and connectivity.
Provides SATA 3.0 layout guidelines and connection topologies.
Details SDIO 3.0/MMC 4.4 interface signal groups.
Shows SDIO 3.0/MMC 4.4 port connection to a connector.
Describes SMI interface connectivity and modes.
Provides general tips and guidelines for SMI signal layout.
Provides guidelines for connecting and using the device bus interface.
Details NAND Flash connectivity via the Device bus.
Provides connectivity and constraints for the core clock.
Recommends connectivity for single-ended clock distribution.
Presents all required clocks for the device.
Details PCI Express interface clock topology options.
Explains AVS connectivity to power regulators and feedback inputs.
| Architecture | ARMv7 |
|---|---|
| CPU | ARM Cortex-A9 |
| Instruction Set | ARMv7 |
| Process Technology | 40 nm |
| L2 Cache | 512 KB |
| Integrated GPU | No |
| Memory Speed | Up to 1066 MHz |
| USB Support | USB 2.0 |
| SATA | SATA 3.0 |
| TDP | 5 W |
| PCI Express | PCIe 2.0 |
| L1 Cache | 32 KB |
| Memory Support | DDR3 |
| Ethernet | 1 Gbps |
| Security Features | TrustZone |
Loading...