CONFIDENTIAL
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Customer Care Europe, Middel East & Africa NHM-8 / RH-9 Repairhints
SCCE Training Group Version 2.0 Approved
2003 Nokia Mobile Phones
Date 10-03-2003
© NMP 2003
Checked by: SCCE
Approved by: Training Group
GENERAL
-How to use this document
Put the colored schematics behind this manual.
Now you are able to follow these specifications with graphical layouts and it is easier for you to find the
components and measuring points.
-Component characteristics
Some components contain important data as tuning values or security data, therefore several steps
described are only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in
certain cases. Please pay attention to separate notes.
-Broken balls / underfill, µBGAs
All replaceable (not underfilled) µBGA components must be renewed after removing. Reflow with
uncontrolled hot air fan is strictly forbidden! µBGA must only be soldered with NMP approved µBGA rework
machines (e.g. Zevac / OK-Metcal / Martin) to get durable soldering joints.
After removing a µBGA check soldering points, if necessary rework oxidated solderings (broken balls)
carefully by tinplating these areas with few flux and a hot soldering iron. Before placing a new component
remove the tin and clean the PCB, e.g. with help of soder wick and flux cleaner such as “Kontakt LR”.
Use only recommended Fluxtype and an appropriate amount of it – avoid drowning the PCB in flux as this
will result in additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible
repair actions as the phone probably was exposed to strong mechanical stress.
“rework” done with uncontrolled hot air PCB drowned in flux broken underfill of an µBGA part
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