NANOSYSTEMFABRICATIONFACILITY(NFF),HKUST
Version1.0
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Contents
1. Picture and Location
2. Process Capabilities
2.1 Cleanliness Standard
2.2 Available Etching Materials
2.3 Performance of the Oxford Plasmalab 80 Plus Plasma Etcher
3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
3.2 Training to Become a Qualified User
4. Operating Procedures
4.1 System Description
4.2 Safety Warnings
4.3 Initial System Checks
4.4 Status Checks
4.5 Venting the Chamber (Before Loading Wafers)
4.6 Opening the Process Chamber
4.7 Inspecting the Chamber Before Use
4.8 Load Wafers
4.9 Closing the Process Chamber
4.10 Pumping Down the System for Dry etching
4.11 Start your Dry Etching Process
4.12 Venting the Chamber (Before Unloading Wafers)
4.13 Pumping the System Down for Idle
5. Appendix
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