Philips BLF278 - Package Outline

2003 Sep 19 21
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
99-03-29
IEC JEDEC EIAJ
SOT262A1
0 5 10 mm
scale
Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262A1
p
A
F
b
e
D
q
U
1
D
1
H
1
U
2
H
Q
c
5
12
43
E
E
1
C
A
w
1
AB
M M M
B
M
w
3
M M
w
2
C
UNIT
A
mm
Db
5.85
5.58
0.16
0.10
22.17
21.46
11.05
10.29
10.03
21.08
19.56
9.91
9.65
5.77
5.00
c
e U
2
0.250.25 0.51
w
3
27.94
qw
2
w
1
F
1.78
1.52
U
1
34.17
33.90
H
1
17.02
16.51
p
3.28
3.02
Q
2.85
2.59
EE
1
D
1
10.27
10.05
inches
0.230
0.220
0.006
0.004
0.873
0.845
21.98
21.71
0.865
0.855
0.435
0.405
0.396
0.830
0.770
0.390
0.380
0.227
0.197
0.0100.010 0.0201.100
0.070
0.060
1.345
1.335
0.670
0.650
0.129
0.119
0.112
0.102
0.404
0.396
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)