Samsung MX-F870 - Safety Warnings; FCC Note for USA

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4
2.ProductSpecication.........................................................................................................................2−1
2.1.ProductFeature.......................................................................................................................2−1
2.1.1.ProductFeatureMX-F830/MX-F830B............................................................................2−1
2.1.2.ProductFeatureMX-F850.............................................................................................2−2
2.1.3.ProductFeatureMX-F870.............................................................................................2−3
2.2.Specications..........................................................................................................................2−4
2.3.SpecicationsAnalysis.............................................................................................................2−6
2.4.Accessories............................................................................................................................2−7
2.4.1.SuppliedAccessories...................................................................................................2−7
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.MainDisassemblyandReassembly.............................................................................................3−1
4.Troubleshooting................................................................................................................................4−1
4.1.CheckpointsbyErrorMode.......................................................................................................4−1
4.1.1.NoPower...................................................................................................................4−2
4.1.2.NoOutput..................................................................................................................4−3
4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−7
4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−7
4.2.2.CheckAMPinPowerProtection....................................................................................4−8
4.3.MICOM,MPEGInitialization&Update......................................................................................4−9
4.4.Buyer-RegionCodeSettingMethod............................................................................................4−10
4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−10
5.PCBDiagram...................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−1
5.2.MAINPCBTop......................................................................................................................5−2
5.2.1.PinConnection...........................................................................................................5−3
5.2.2.TestPointWaveForm..................................................................................................5−4
5.3.MAINPCBBottom..................................................................................................................5−5
5.4.FRONT-JACKPCBTop...........................................................................................................5−6
5.5.FRONT-JACKPCBBottom......................................................................................................5−7
5.5.1.PinConnection...........................................................................................................5−8
5.6.FRONT-VFDPCBTop.............................................................................................................5−9
5.6.1.PinConnection...........................................................................................................5−10
5.7.FRONT-VFDPCBBottom........................................................................................................5−11
5.8.SPKLEDPCBTop..................................................................................................................5−12
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