SDC Emlock 1511 - EZ-B-10-2 Magnetic Bond Sensor; Advanced Security Monitoring Features

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SECURITY DOOR CONTROLS
EZ Option Upgrade Kits - Emlock© 1512 / 1572
Remove cover plate screws.
1 2
Remove
cover plate.
6
Place magnetic coil firmly
between core lamination
as shown.
Connect
magnetic
bond sensor
wires to the input
module B Option
connector as shown.
5
The Magnetic Bond
Sensor should be
positioned as shown
below, after step 4.
+
3
4
5
6
7
8
EZ-B-10-2 MAGNETIC BOND SENSOR
Modular Kit
Remove cover plate screws.
2
Remove
cover plate.
3
6 7
Lift input module
and magnetic coil
from the case.
Place magnetic coil firmly
between core lamination
as shown.
Connect
magnetic
bond sensor
wires to the input
module B Option
connector as shown.
3
Place input module vertically
between post at each
side of case.
The Magnetic Bond
Sensor should be
positioned as shown
below, after step 4.
Cradle
Position Posts
+
3
4
5
6
7
8
+
3
4
5
6
7
8
+
3
4
5
6
7
8
2
Remove
cover plate.
3
6 7
Lift input module
and magnetic coil
from the case.
Place magnetic coil firmly
between core lamination
as shown.
Connect
magnetic
bond sensor
wires to the input
module B Option
connector as shown.
3
Place input module vertically
between post at each
side of case.
The Magnetic Bond
Sensor should be
positioned as shown
below, after step 4.
Cradle
Position Posts
PC Board
+
3
4
5
6
7
8
+
3
4
5
6
7
8
Input module wiring.8
B Option
Connector
B Option
Magnetic Bond Sensor
D Option
Door Status Sensor
Magnetic Core
12 or 24 VDC
LOCKED - NO
COM
UNLOCKED - NC
CLOSED - NO
COM
OPEN - NC
4
Remove 2 screw
from the case
bottom.
Place the
Magnetic Bond
Sensors at the
base of each
Magnetic Core.
Secure sensor
in place with
screw as
shown.
Remove cover plate screws.
1 2
Remove
cover plate.
6
9
Attach cover plate.
Place magnetic coil firmly
between core lamination
as shown.
connector as shown.
5
The Magnetic Bond
Sensor should be
positioned as shown
below, after step 4.
+
3
4
5
6
7
8
Remove cover plate screws.
1 2
Remove
cover plate.
6
9
Attach cover plate.
Place magnetic coil firmly
between core lamination
as shown.
Connect
magnetic
bond sensor
wires to the input
module B Option
connector as shown.
5
The Magnetic Bond
Sensor should be
positioned as shown
below, after step 4.
+
3
4
5
6
7
8
Input module wiring.8
B Option
Connector
B Option
Magnetic Bond Sensor
D Option
Door Status Sensor
Magnetic Core
Connector
12 or 24 VDC
LOCKED - NO
COM
UNLOCKED - NC
CLOSED - NO
COM
OPEN - NC
3
7
Lift input module
and magnetic coil
from the case.
43
Place input module vertically
between post at each
side of case.
Remove 2 screw
from the case
bottom.
Place the
Magnetic Bond
Sensors at the
base of each
Magnetic Core.
Secure sensor
in place with
screw as
shown.
Cradle
Position Posts
PC Board
+
3
4
5
6
7
8
+
3
4
5
6
7
8
Input module wiring.8
B Option
Connector
B Option
Magnetic Bond Sensor
D Option
Door Status Sensor
Magnetic Core
Connector
12 or 24 VDC
LOCKED - NO
COM
UNLOCKED - NC
CLOSED - NO
COM
OPEN - NC
Lift input module
and magnetic coil
from the case.
4
Place input module vertically
between post at each
Remove 2 screw
from the case
bottom.
Place the
Magnetic Bond
Sensors at the
base of each
Magnetic Core.
Secure sensor
in place with
screw as
shown.
Cradle
Position Posts
PC Board
+
3
4
5
6
7
8
+
3
4
5
6
7
8
Remove cover plate screws.
1
9
Attach cover plate.
5
The Magnetic Bond
Sensor should be
positioned as shown
below, after step 4.
+
3
4
5
6
7
8
While a Door Status Sensor indicates the door is open
or closed, SDC’s Magnetic Bond Sensor provides higher
security monitoring by indicating the locked / unlocked
mode, tampering and low voltage. The use of
both the door status and magnetic bond sensor is
recommended for high security applications.
Application: Lock secure status annunciation,
mantrap system logic,
CCTV camera activation.
Output: 2 Contacts provided
2-SPDT Dry Contact,
250 mA @ 12/24VDC
Specify 2 for 1512, 1572