Sony HCD-H170 - DISASSEMBLY PROCEDURES; TC Mechanism and Volume;Display Board Removal

3-5. TC MECHANISM BLOCK
To mechanism block
@ cassette lid assy © BVTT3 x6
3~ 6. VOLUME/MIC HP/DISPLAY/SW BOARD
eo @ BV (2.6 x 8) TAPPING
front panel assy
@ mic hp board
@ BV (2.6 x 8) TAPPING
@ BV (26 x 8) TAPPING
© volume boaci
@ case bracket