Sony MDR-RF830 - Page 17

MDR-RF830
— 7 — — 8 —
Note:
• X : parts extracted from the component side.
•
®
: Through hole.
• b : Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(SideB) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
3.1 PRINTED WIRING BOARDS
Ref. No. Location
D301 B-3
D302 E-3
D303 D-4
IC301 D-3
IC302 C-4
IC303 C-3
IC304 C-3
Q301 C-3
Q302 E-3
Q303 C-4
Q304 E-4
Q305 E-3
Q306 E-3
Q307 C-3
Q308 D-3
Q309 C-3
• Semiconductor
Location