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Sony TC-WR665S Service Manual

Sony TC-WR665S
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__TG-WATES/WRO65/WR665S
SERVICE
MANUAL
Photo
:
TC-WR665S
US
Model
TC-WA7ES/WR565/WR665S
Canadian
Model
AEP
Model
UK
Model
E
Model
Australian
Model
Chinese
Model
TC-WR565/WR665S
*
Dolby
noise
reduction
and
HX
Pro
headroom
extension
manufactured
under
license
from
Dolby
Laboratories
Licensing
Corporation.
HX
Pro
originated
by
Bang
&
Olufsen.
“DOLBY”,
the
double-D
symbol
D0
and
“HX
PRO”
are
trademarks
|
Tape
Transport
Machanism
|
DECK
A
of
Dolby
Laboratories
Licensing
Corporation.
Model
Name
Using
Similar
Mechanism
|
TC-WR545/WR741
TC-WR565/WR665S
:
TCM-190RA14CL
TC-WAT7ES
:
|
TCM-190RA12CL
DECK
B
|
TCM-190RB12CL
SPECIFICATIONS
System
Recording
system
4-track
2-channel
stereo
Fast-winding
time
(approx.)
90
sec.
(with
Sony
C-60
cassette)
Bias
AC
bias
Singnal-to-noise
ratio
(at
peak
level
and
weighted
with
Dolby
NR
off)
Type
I
tape,
Sony
Type
I
(NORMAL):
55
dB
Type
IL
tape,
Sony
Type
II
(HIGH)
:
57
dB
Type
IV
tape,
Sony
Type
IV
(METAL)
:
58
dB
S/N
ratio
improvement
(approximate
values)
With
Dolby
B
NR
on:
5dB
at
1kHz,
10dB
at
5kHz
With
Dolby
C
NR
on:
15dB
at
500Hz,
20dB
at
1kHz
With
Dolby
S
NR
on
(TC-WA7ES/WR665SS
only)
:
10dB
at
100Hz,
24dB
at
1kHz
Harmonic
distortion
0.4%
(with
Type
I
tape,
Sony
Type
I
(NORMAL)
:
160
nWb/m
315
Hz,
3rd
H.D.)
1.8%
(with
Type
IV
tape,
Sony
Type
IV
(METAL)
:
250
nWb/m
315
Hz,
3rd
H.D.)
Frequency
response
(Dolby
NR
off)
Type
I
tape,
Sony
Type
I
(NORMAL):
30-15,000Hz
(
+
3dB,
IEC)
Type
II
tape,
Sony
Type
II
(HIGH)
:
30-17,000Hz
(
+
3dB,
IEC)
Type
IV
tape,
Sony
Type
IV
(METAL)
:
30-18,000Hz
(
+
3dB,
IEC)
30-13,000Hz
(
+
3dB,
4dB
recording)
Wow
and
flutter
TC-WA7ES/WR665S
:
+
0.13%
W.
Peak
(IEC)
0.07%
W.
RMS
(NAB)
+
0.18%
W.
Peak
(DIN)
+
0.14%
W.
Peak
(IEC)
0.08%
W.
RMS
(NAB)
+
0.19%
W.
Peak
(DIN)
Variable
pitch
range
(approx.)
30
to
+30%
TC-WRS65
:
Inputs
Line
inputs
(phono
jacks)
Sensitivity
:
0.16V
Input
inpedance
:
47
kilohms
Outputs
Line
outputs
(phono
jacks)
Rated
output
level
:
0.5V
at
a
load
impeadance
of
47
kilohms
Load
impedance
:
Over
10
kilohms
Headphones
(stereo
phone
jack)
Output
level
:
ImW
at
a
load
impedance
of
32
ohms
STEREO
CASSETTE
DECK
SONY.

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Sony TC-WR665S Specifications

General IconGeneral
Track System4-Track, 2-Channel Stereo
Tape Speed4.8 cm/s
MotorDC Servo Motor
Total Harmonic Distortion0.8%
Power SupplyAC 120V, 60Hz
TypeDouble Cassette Deck
Frequency Response (Normal Tape)30 Hz - 14 kHz
Frequency Response (Chrome Tape)30 Hz - 16 kHz
Frequency Response (Metal Tape)30 Hz - 17 kHz
Wow and Flutter0.07%
OutputLine Out
InputsLine In
OutputsLine Out, Headphone
Dimensions430 x 120 x 300mm

Summary

SPECIFICATIONS

System Specifications

Details on recording system, bias, noise ratio, distortion, and frequency response.

Wow and Flutter

Measurement of speed variations in tape playback.

Input/Output Specifications

Details on line inputs and outputs, sensitivity, and impedance.

SAFETY CHECK-OUT

Leakage Test Procedures

Methods to test and ensure electrical safety by measuring AC leakage current.

GENERAL INFORMATION

Identifying Front Panel Components

Labels and functions of controls and indicators on the front panel.

DISASSEMBLY PROCEDURES

Front Panel Disassembly

Steps to remove the front panel assembly and related components.

Mechanism Deck Disassembly

Procedures for disassembling the cassette mechanism deck.

Motor and Head Assembly Disassembly

Steps for removing capstan motor, reel motor, and head components.

ADJUSTMENT PROCEDURES

Mechanical Adjustments

Cleaning, demagnetizing, and torque measurement for mechanical parts.

Electrical Adjustments

Procedures for calibrating electrical performance using test signals.

Record/Playback Head Azimuth Adjustment

Aligning the playback head for optimal stereo separation and frequency response.

Tape Speed Adjustment

Calibrating the tape transport speed for accurate playback and recording.

Playback Level Adjustment

Setting the output signal level for correct playback volume.

Bias Consumption Current Adjustment

Adjusting current for head assembly or bias transformer replacement.

Record Level Adjustment

Setting the recording input level for optimal signal strength.

Record Bias Adjustment

Adjusting bias signal for proper tape recording characteristics.

ADJUSTMENT PARTS LOCATION

System Control Board Adjustment Points

Location of adjustment potentiometers on the system control board.

Audio Board Adjustment Points

Location of adjustment potentiometers on the audio boards for both decks.

Connector Board Adjustment Points

Location of adjustment potentiometers on the connector board.

IC TERMINAL EXPLANATIONS

IC Terminal Descriptions

Detailed explanation of each pin function for the main ICs used in the unit.

DIAGRAMS AND SCHEMATICS

Block Diagram

High-level overview of the unit's functional blocks and signal flow.

System Control Board Wiring

Printed wiring layout for the system control board.

System Control Schematic

Detailed circuit diagram for the system control section.

Audio Section Schematic

Detailed circuit diagram for the audio processing and playback sections.

Audio Section Wiring

Printed wiring layout for the audio boards of both decks.

Dolby S Section Wiring

Printed wiring layout for the Dolby S processing board.

Dolby S Section Schematic

Detailed circuit diagram for the Dolby S noise reduction circuitry.

EXPLODED VIEWS

Chassis Section Exploded View

Diagram showing the main chassis components and their assembly.

Front Panel Section Exploded View

Diagram illustrating the assembly of the front panel and its associated parts.

Mechanism Section 1 Exploded View

Diagram showing the exploded view of the primary cassette mechanism parts.

Mechanism Section 2 Exploded View

Diagram illustrating the exploded view of secondary cassette mechanism components.

ELECTRICAL PARTS LIST

Capacitors

List of capacitors used in the unit, including part numbers and specifications.

Resistors

List of resistors used in the unit, including part numbers and specifications.

Transistors

List of transistors used in the unit, including part numbers and types.

Integrated Circuits (ICs)

List of integrated circuits used in the unit, including part numbers.

Connectors and Other Components

List of connectors, coils, filters, and other miscellaneous parts.

HARDWARE LIST

Hardware Components

List of screws, bushings, and other hardware used in the assembly.

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