Sony WM-DD11 - Page 7

2-1. SEMICONDUCTOR
LEAD LAYOUTS
FMW
2
5 itr} ‘Collector 1
212 ‘Collector 2
4 3Tr2 ‘Base 2
4Tr1,2 Emitter
3 5Trl ‘Base 1
2SB709A-Q
2SB1295- UL6
2SB798- DL
MA110
Anode
Cathode
TLR124
long short
onode cathode
* Semiconductor Location
Location
NO
eorod
DOU LOMVGG)
3
9
5
-6
1
8
1
1
1 NOOO
2-2. PRINTED WIRING BOARD
(2 eee a a eae ee Ae ee aE eae 8 aa aE I 2
:
{AUDIO BOARD]
J301 —| tt 1
DC IN 3V DRY BATTERIES
SIZE "AA"
O-C-O) Qa (EC DESIGNATION R6,
JIS SUM-3 OR EQUIVALENT)
2PCS.3V
J302
| A —
HEADPHONES
ue
%
™/~
. / - |
RV301
. |
_ |
D301
$301
DOLBY NR TAPE
[HEAD FLEXIBLE] rare]
rO2
BOARD
“BBA
Oe
OFF
NORM
—»
OCF
)
(San
One|
HP9014
M901
FG901
re PB HEAD
1? ee i 8
Note on Mounting Diagram:
Oo——— : parts extracted from the component side.
@ = =: parts mounted on the conductor side.
: Through hole.
e Pattern on the side which is seen.
e > Pattern of the rear side,
7
®
{"]
:
Chip
components
extracted
from
the
rear
side.