Sony XR-CA330 - Table of Contents

2
XR-CA330/CA340
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 3
Installation ....................................................................... 4
Connections ..................................................................... 5
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 8
2-2. Sub Panel ......................................................................... 8
2-3. Mechanism Deck (MG-36SZ12-32)............................... 9
2-4. MAIN Board ................................................................... 9
2-5. Heat Sink ......................................................................... 10
2-6. Bracket (MD) .................................................................. 10
2-7. Motor (Capstan/Reel) (M901) ........................................ 11
2-8. Main Belt, Sub Belt (C) .................................................. 11
2-9. Head (Playback) (HP901) ............................................... 12
3. MECHANICAL ADJUSTMENTS ....................... 13
4. ELECTRICAL ADJUSTMENTS......................... 13
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
5. DIAGRAMS
5-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 18
5-2. Printed Wiring Board – MAIN Board – ........................ 19
5-3. Schematic Diagram – MAIN Board (1/2) – .................. 20
5-4. Schematic Diagram – MAIN Board (2/2) – .................. 21
5-5. Printed Wiring Board – CONTROL Board – ................ 22
5-6. Schematic Diagram – CONTROL Board –................... 23
5-7. IC Pin Function Description ........................................... 25
6. EXPLODED VIEWS
6-1. General Section ............................................................... 27
6-2. Front Panel Section ......................................................... 28
6-3. Mechanism Deck Section (MG-36SZ12-32) ................. 29
7. ELECTRICAL PARTS LIST ............................... 30
Ver 1.2
SERVICING NOTE
TYPE A/B DISCRIMINATION
In this set with following serial No. or later IC500 on MAIN board
has been changed in the midway of production. With the conse-
quence of this change, parts mounted on MAIN board have been
changed.
MODEL TYPE SERIAL No.
XR-CA330
A 2620428 or before
B 2620429 or later
XR-CA340 TYPE A only (No TYPE B)