ST ST7735R - 3 Pad arrangement; 3.1 Output Bump Dimension

ST7735R
V0.2 2 2009-08-05
3 Pad arrangement
3.1 Output Bump Dimension
C K
H
A
L
J
Boundary (Include scribe Lane)
Item Symbol Size
Bump pitch A 16 um
Bump width C 16 um
Bump height H 98 um
Bump gap1 (Vertical) J 19 um
Bump gap2 (Horizontal) K 16 um
Bump area C x H 1568 um2
Chip Boundary (include scribe Lane) L 59 um