Operations Model 6DS-SP Planarizer
2 - 48 Version 4.0 - February 1998
Notes: For both one and two table machines: If spindle flush is
enabled, when wafers are removed from the load chucks by the
robot, a spindle flush starts.
For two table machines only: The carriers are cleaned by
rotating while being sprayed with D. I. water.
27. If carrier cleaning is enabled:
a. The shuttle moves backward to its rear position.
b. The spindles move down into the cleaning stations.
c. The spindles begin rotating as the carrier cleaning cycle begins.
d. When the cleaning cycle is finished, the spindles move up.
e. The shuttle moves forward.
f. The machine begins the next auto cycle.
or
28. If carrier cleaning is not enabled, the carrier cleaning sub-sequence is
skipped.
29. The machine begins the next auto cycle.
E. CASSETTE REMOVAL
The operator:
1. opens the elevator doors.
2. raises the elevator cassette sensor arm.
3. closes the elevator doors and waits for the elevators to rise to slot 26.
4. removes the cassette of processed wafers from the receive elevator.
F. CYCLE HALT
• The operator presses the <CYCLE HALT> pushbutton on the control
panel.
For further details on cycle termination and choices available at the Auto
Polish Cycle menu when no cycle is running, refer to the Operator Functions
chapter of the 6DS-SP Operations manual.
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