R. Howard Strasbaugh, Inc.
July 14, 1995 6DS-SP Ver 4.14 Page 3
Two Table Machine Wafer Cleaning and Carrier Pad Cleaning:
This feature requires fountain rinses at the load stations that have been modified to have a
spray pattern that is essentially straight up. Wafer or carrier pad cleaning is accomplished
by using these fountain rinses with the spindles up over the load stations.
If the 6DS-SP is set for two tables, the following choices will show on the
Conditioning/Cleaning Parameters menu, page 2:
Post Polish Wafer Cleaning Enable/Disable
Wafer Cleaning Time 0 secs
Carrier Cleaning (Auto only) Enable/Disable
Carrier Cleaning Time 0 secs
If Post Polish Wafer Cleaning is enabled, the bridge will move polished wafers to the
load stations, the fountain rinses will turn on and the carriers will rotate. This will
continue for the period entered in Wafer Cleaning Time. When finished, the wafers will
be unloaded and the cycle will continue with the original rinsing of the unloaded wafers.
If Carrier Cleaning is enabled, after the robot removes a polished wafer its load station,
that station's fountain rinse will turn on and the carrier will rotate. This will continue for
the period entered in Carrier Cleaning Time. Carrier cleaning will occur only if the
cycle is "Auto". It will not occur if the cycle is "Manual" or "Condition". Also, if spindle
flushing is enabled, it will start at the same time as carrier cleaning so that both functions
run concurrently to minimize cycle time. Loading of the next wafer to be polished is
inhibited until both spindle flushing and carrier cleaning are finished.
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