Operations Model 6DS-SP Planarizer
1 - 10 Version 4.0 - February 1998; Update 10/19/01
MECHANICAL COMPONENTS
The machine consists of three major mechanical components, all enclosed
within the machine’s cabinet to provide a sturdy, safe, and clean polishing
process:
• The polishing section of the machine is comprised of the polish table
and associated mechanical support hardware.
• The cassette wafer handling assembly is designed to provide a safe and
convenient method for robotic loading and unloading of wafers.
Mechanical, electrical, and software interlocks provide for user safety
during all machine operations.
• The bridge assembly, a rigid structure containing the spindle drive
assemblies and their support hardware, travels on ball bearing slides to
supply smooth, accurate horizontal motion of the spindle drive
assemblies. The bridge traverses from the (primary) polish table to the
load stations or the optional second table to facilitate transfer of wafers
in process through the machine. In addition, the bridge provides the
oscillatory motion of the spindle drives during wafer polishing upon the
polish table. Together the rigid bridge structure and smooth oscillatory
motion of the spindle drives produce wafer surface uniformity and
maximize polish table pad life.
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