Maintenance Model 6DS-SP Planarizer
4 - 12 Version 4.0 - February 1998
LEFT/RIGHT LOAD/UNLOAD
STATIONS
Each load station is equipped with a load chuck mounted on an air cylinder
(which raises and lowers the chuck). The load chuck takes vacuum on a wafer
through vacuum ports. The load chuck lowers the wafer into the centering ring
which has beveled sides to aid in centering the wafer in the ring. A vacuum
sensor, mounted on a bracket located on the cabinet wall adjacent to the load
station, notifies the control computer when a wafer is placed in the ring. A rinse
nozzle mounted on each ring wets the wafers before and after polishing. Load
chuck rinsing during polish cycles is selectable at page 3 of the Machine
Parameters Menu with choices available for rinsing at intervals, rinsing steadily,
or no rinsing. Both the left and right load chucks will be rinsed even if only one
spindle is in use. Load chuck rinsing does not occur in “condition” mode.
The fountain rinse option provides rinsing of the front side of the wafer as a
part of the post polish wafer handling sequence. For machines equipped with
fountain rinsing, the function is enabled at page 3 of the Machine Parameters
Menu.
LEFT/RIGHT CARRIER/WAFER
CLEANING STATIONS
The carrier/wafer cleaning stations rinse and scrub carriers and wafers. The
stations can rinse both carriers and wafers at all times, but they can scrub only
the item (carrier or wafer) for which the appropriate brush is installed. Each
cleaning station is equipped with a cleaning device powered by a brushless DC
servo motor. The cleaning device is mounted on an air cylinder which raises and
lowers the it during cleaning. A rinse nozzle mounted inside the station sprays
D. I. water on the carrier/wafer. Polymer rollers mounted in each cleaning
station permit the carriers/wafers to rotate during cleaning.
To Next Page
Loading...
