4.2 Bill of Materials and Schematic
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Circuit Module Physical Layouts and Bill of Materials
Figure 4. Bottom Layer
Figure 5. Bottom Assembly
Table 3. Bill of Materials
Count RefDes Description Size Mfr Part Number
21 C1–C9, C12, Capacitor, Ceramic, 0.1 µ F, 50 V, X7R, 20% 0603 Any STD
C13, C15–C18,
C23, C24,
C26–C28
1 C11 Capacitor, Ceramic, 0.22 µ F, 50 V, X7R, 20% 0603 Any STD
1 C19 Capacitor, Ceramic, 4.7 µ F, 10 V, X7R, 20% 0603 Any STD
1 C20 Capacitor, Ceramic, 47nF, 50 V, X7R, 20% 0603 Any STD
2 C22, C25 Capacitor, Ceramic, 0.47 µ F, 16 V, X7R, 20% 0603 Any STD
3 C10, C14, C21 Capacitor, Ceramic, 1.0 µ F, 25 V, X7R, 20% 0805 Any STD
4 D1–D3, D11 Diode, Switching, 150-mA, 75-V, 350mW SOT23 Vishay-Liteon BAS16
2 D4, D5 Diode, Dual, Zener, 5.6V, 300mW SOT23 Vishay- AZ23C5V6
Telefunken
5 D6–D10 Diode, LED, Green, Gullwing, GW Type, 20ma, 7.5 0.120 × 0.087 Panasonic LN1361C
mcd typ. inches
1 J1 Header, Friction Lock Ass'y, 4-pin Right Angle, 0.400 × 0.500 Molex 22-05-3041
1 Q1 MOSFET, N-ch, 20-V, 1.3A, 0.16- Ω SOT23 Fairchild NDS331N
2 Q2, Q4 MOSFET, N-ch Logic Level, Power Trench, 30V, 11A, SO8 Fairchild FDS6690A
12.5 m Ω
SLUU353 – June 2009 bq20z65EVM-001 SBS 1.1 Impedance Track™ Technology 5
Enabled Battery Management Solution Evaluation Module
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