MAX-M10S-Integration manual
Figure 30: Recommended copper land and solder mask opening for MAX-M10S
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase it outside of the module by defining the dimensions of the paste mask to form a T-shape
(or equivalent) extending beyond the copper mask.
Recommended stencil thickness is 150 µm.
Figure 31: Recommended paste mask pattern for MAX-M10S
UBX-20053088 - R03
3 Hardware integration Page 72 of 89
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