Ublox NINA-W1 Series - Design-in; Handling and Soldering

NINA-W1 series - User Manual
3.2.1 Module supply (VCC) design ........................................................................................................... 27
3.2.2 Digital I/O interfaces reference voltage (VCC_IO) ...................................................................... 27
3.3 Antenna interface ..................................................................................................................................... 28
3.3.1 On-board antenna design ............................................................................................................... 28
3.4 Data communication interfaces ............................................................................................................ 29
3.4.1 Asynchronous serial interface (UART) design ............................................................................ 29
3.4.2 Ethernet (RMII+SMI) ........................................................................................................................30
3.5 General High Speed layout guidelines ..................................................................................................30
3.5.1 General considerations for schematic design and PCB floor-planning .................................30
3.5.2 Module placement ............................................................................................................................30
3.5.3 Layout and manufacturing .............................................................................................................30
3.6 Module footprint and paste mask ......................................................................................................... 31
3.7 Thermal guidelines ................................................................................................................................... 31
3.8 ESD guidelines ........................................................................................................................................... 31
Handling and soldering ..................................................................................................................... 33
4.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 33
4.2 Handling ...................................................................................................................................................... 33
4.3 Soldering ..................................................................................................................................................... 33
4.3.1 Reflow soldering process ................................................................................................................ 33
4.3.2 Cleaning .............................................................................................................................................. 34
4.3.3 Other remarks ................................................................................................................................... 35
Approvals ............................................................................................................................................... 36
5.1 European Union regulatory compliance ............................................................................................... 36
5.1.1 Radio Equipment Directive (RED) 2014/53/EU ........................................................................... 36
5.1.2 Compliance with the RoHS directive ............................................................................................ 36
5.2 United States (FCC) ................................................................................................................................. 36
5.2.1 Labeling and user information requirements ............................................................................. 37
5.2.2 RF exposure ....................................................................................................................................... 37
5.2.3 Module statement ............................................................................................................................ 38
5.2.4 End-product compliance ................................................................................................................. 38
5.3 Canada (ISED) ............................................................................................................................................ 39
5.3.1 Labeling and user information requirements ............................................................................. 39
5.3.2 RF exposure ....................................................................................................................................... 39
5.4 Japan radio equipment compliance ...................................................................................................... 40
Product testing .................................................................................................................................... 41
6.1 u-blox In-Series production test ............................................................................................................. 41
6.2 OEM manufacturer production test ..................................................................................................... 41
6.2.1 “Go/No go” tests for integrated devices ...................................................................................... 42
Appendix ....................................................................................................................................................... 43
A Glossary ................................................................................................................................................. 43