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VIA Technologies P4M900 - Specification

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3
1-2 Specification
Spec Description
Design
∗ Micro ATX form factor 4 layers PCB size: 24.4x21.0cm
Chipset
∗ VIA P4M900 North Bridge Chipset
∗ VIA VT8237R Plus South Bridge Chipset
CPU Socket
(LGA 775 Socket)
∗ Support Intel Pentium 4, Celeron D, Pentium D, and Core 2 Duo
775-Land LGA Package utilizes Flip-Chip Land Grid Array
(FCLGA4) package processor
∗ Support FSB Frequency 533MHz / 800 / 1066MHz
Memory Socket
∗ 240-pin DDRII Module socket x 2
∗ Support 2pcs DDRII 667/553 / 400 system memory modules
which are expandable to 4.0GB
Expansion Slot
∗
PCI-Express x16 slot 1pcs deliver up to 8GB/s concurrent bandwidth
∗
PCI-Express x1 slot 1pcs delivers up to 512MB/s concurrent
bandwidth
∗
32-bit PCI slot x 2pcs
Integrate IDE and
Serial ATA RAID
∗ Two PCI IDE controllers support PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 33/66/100/133 functions that
deliver the data transfer rate up to 133 MB/s; Two Serial ATA
ports provide 150 MB/sec data transfer rate for two Serial ATA
Devices and offer RAID 0, 1, JBOD functions
VGA
∗ Integrated Chrome9™ HC IGP
∗ 128 bit 2D/3D engine with dual pixel pipeline
∗ 250MHz engine clock speed.
LAN
∗ Integrated VIA 6103L PCI-10 /100 LAN PHY
∗ Supports Fast Ethernet LAN function provide 10Mb / 100Mb /
s data transfer rate
Audio
∗ VIA VT1616B AC’97 Digital Audio controller integrated
∗ 6-channel AC’97 Audio CODEC onboard
∗ Audio driver and utility included
BIOS
∗ Award 4MB Flash ROM
Multi I/O
∗ PS/2 keyboard and PS/2 mouse connectors
∗ Floppy disk drive connector x1
∗ Parallel port x1
∗ Serial port x1
∗ VGA port x1
∗ USB2.0 port x 4 and headers x 4 (connecting cable option)
∗ Audio connector (Line-in, Line-out, MIC)