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Winbond SpiFlash W25Q256FV - User Manual

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FOR MOBILE APPLICATIONS
W25Q256FV
Publication Release Date: May 13, 2012
Preliminary - Revision M1
3V 256M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
For Mobile Applications

Table of Contents

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Summary

General Descriptions and Features

2. FEATURES

Key features and specifications of the W25Q256FV SpiFlash memory.

Package Types and Pin Configurations

Block Diagram

Functional Descriptions

6.1 SPI; QPI Operations

Explanation of Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) modes.

6.2 Write Protection

Methods for protecting data integrity against inadvertent writes.

Status and Configuration Registers

7.1 Status Registers

Description of Status Register bits for device status and configuration.

Instructions

8.2 Core Instructions

Essential instructions for device operation: Write, Read, Erase, Program.

Electrical Characteristics

Ordering Information

Winbond SpiFlash W25Q256FV Specifications

General IconGeneral
Memory TypeNOR Flash
Density256 Mbit
InterfaceSPI
Clock FrequencyUp to 104 MHz
Operating Temperature-40°C to +85°C
Page Size256 bytes
Sector Size4 KB
Block Size64 KB
Data Retention20 years
Voltage Range2.7V - 3.6V
PackageSOIC, WSON, BGA
Endurance100, 000 cycles
Package / CaseSOIC-8

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