The XYTRONIC LF-852D is a hot-air SMD rework station designed for soldering and desoldering Surface Mount Devices with temperature-controlled hot air. It is particularly effective when used in conjunction with a 628 Preheat system, which enhances the quality and efficiency of rework tasks. This appliance is not intended for use by children or other persons without assistance or supervision if their physical, sensory, or mental capabilities prevent them from using it safely. Children should be supervised to ensure they do not play with the appliance. Failure to observe safety regulations can result in a risk to life and limb, and the manufacturer is not liable for damage from misuse or unauthorized alterations.
Important Safety Warnings and Cautions:
- Electrical Shock: Always ensure the unit is grounded and connected to a grounded receptacle. Do not pressure the AC power cord, expose the unit to moisture, or use it with wet hands. To prevent electric shock, isolate the equipment from the mains before commencing repairs or maintenance.
- High Temperature Operation: The heater and nozzle become extremely hot during operation and can cause serious burns. Use gloves and/or heat-resistant tools to handle PCB assemblies. Do not aim hot air at your eyes. Allow the equipment to cool before maintenance.
- Flammable Materials: Do not use the product near combustible gases or flammable materials.
- Cooling Process: After use, turn the power switch OFF and allow the heater to cool. The unit will automatically blow cooling air through the pipe for a short period. Do not disconnect the plug during this cooling process.
- Continuous Use: To prolong the life of the heating element, continuous use at low airflow and high temperature is not recommended. Allow the heating element to cool after a maximum of 20 minutes of use. Place the hand tool back on its cooling stand between rework operations. Do not switch the hand tool on while it is in the cooling stand.
- Airflow Blockage: Do not block the air outlet in the full area of the nozzle, as this may cause heat reflection and damage the heating element.
- Supervision: Do not leave the machine unattended while operating. Turn off the machine and unplug the power cord when leaving.
- Damage: If the pump doesn't work or the rework station becomes faulty, discontinue use immediately. Only authorized technicians should replace the pump or other parts using original replacement parts.
- Unplugging: Always switch off the station and unplug the power cord before replacing the fuse. Disconnect the plug when the unit is not in use for extended periods, as a small amount of electricity flows even when the power switch is off.
- Physical Shock: Do not bump, hit, pour water/liquids, or otherwise subject the heating surface to physical shock, as this may damage the heater.
- Modifications: Do not modify the unit.
- Cleaning: Keep the appliance clean with a damp cloth and a small amount of liquid detergent. Never submerge the unit in liquid or allow liquid to enter the station. Never use solvents to clean the case.
- Intended Use: This unit is designed for SMD rework and should not be used for any other purpose without consulting the manufacturer or its authorized agent.
Product Features:
- Intelligent Control: Features a specially designed intelligent chip microcomputer control with double LED display for convenient operation via key presses.
- Digital Display: Temperature and airflow are displayed digitally for easy reading.
- High Power Heating: Equipped with a high-power heating element, providing quick heat-up times with momentary power reaching 550W.
- Adjustable Temperature: Temperature is adjustable, suitable for removing QFP, SOP, PLCC, or SOJ chips. The built-in static-free circuit design ensures safety for sensitive components like CMOS ICs.
- Auto-Cooling Design: When the power switch is turned off, the cooling system automatically activates, reducing the temperature to 75°C (167°F) to protect the heating element from burning.
- Heating Element Auto-Protection: The heating element has an auto-protecting function that activates when it reaches a high temperature, extending its lifespan.
Product Description:
The LF-852D SMD rework station incorporates an intelligent microcomputer chip, specifically designed for lead-free SMD chips such as SOIC, CHIP, QFP, PLCC, and BGA, to meet RoHS requirements. It features a high-power heating element for very fast heat-up times. A high-quality sensor and advanced heat transfer technology ensure precise temperature regulation, which is crucial for consistent and reliable rework. The aluminum housing provides a strong structure, excellent heat dissipation, and effective resistance to electromagnetic interference.
Important Technical Specifications:
- Model: LF-852D REWORK STATION
- Power Voltage: 100-120Vac 60Hz or 220-240Vac 50Hz
- Power Consumption (Max): 600W
- Pump: Diaphragm 115V or 120V (for 100-120Vac) or 230V or 240V (for 220-240Vac)
- Air Flow: 1.5L-40L/Min
- Temperature Range: 212°F-896°F (100°C-480°C)
- Dimensions: 283(W) x 120(H) x 190(D) mm
- Fuse (Fast type): 5A
Panel Functions (Front Panel):
- Main power switch
- Hot air pencil inlet
- "▲": Temperature increasing (UP)
- "▼": Temperature decreasing (Down)
- Temp Display
- "SET": Temperature setting display
- "▲": Hot air blow (UP)
- Air blow display
- "▼": Hot air blow (DOWN)
Operating Precautions:
- Ensure both the heater and nozzle are cool before attaching the nozzle.
- Caution High Temperature Operation: Do not use the LF-852D near ignitable gases or other inflammable materials. Both the nozzle and hot air are extremely hot and can cause burns. Never touch the nozzle and heater assembly or allow the hot air to blow against your skin. Initially, the iron may emit white smoke, but this will soon dissipate.
- Cool Down: Be sure to cool the unit after using. When the power switch is off, the unit will automatically blow cooling air through the pipe for a short period of time. Do not disconnect the plug during this cooling process.
- Pump Disassembly: Do not disassemble the pump. If the pump or other critical internal components become faulty, discontinue its use immediately. Return to your vendor or authorized repairers for servicing.
- Disconnect Plug: Disconnect the plug while the unit is not in use. Even when the power switch is off, a small current flows when the power cord is connected.
Operation Setup:
- Nozzle Selection: Select the nozzle that matches the size of the IC. Attach the nozzle only when both the heating element and the nozzle are cool, and the unit is turned off and unplugged.
- Nozzle Attachment: Loosen the screw on the nozzle, attach the nozzle, and then tighten the set-screw gently. Do not force the nozzle or pull on its edge with pliers, and do not overtighten the set-screw.
- Suitable for desoldering SMD components such as SOIC, CHIP, QFP, PLCC, BGA, etc.
Operating Instructions:
- Initial Check: Ensure the base unit power switch is in the "OFF" position. Check for any damage during transportation and confirm the working voltage matches your power supply before plugging in.
- Power On: Plug in the AC power cord and turn the "Mains power switch" to "ON." The temperature LED and wind LED displays will turn on and show their values.
- Temperature Adjustment: Press the "▲" or "▼" key on the left side of the front panel to select the desired temperature. The heating indicator light will flash on and off to maintain the set temperature once it is reached. The temperature changes by 1 degree with each press.
- Airflow Adjustment: Press the "▲" or "▼" key on the right side of the front panel to choose the desired airflow. The speed will change by 5 degrees with each press.
- Stabilization: After adjusting the airflow and temperature, wait for a short period for the temperature to stabilize.
QFP Desoldering:
- Melt Solder: Hold the iron so the nozzle is directly over, but not touching, the IC. Allow the hot air to melt the solder. Be careful not to touch the IC leads with the nozzle.
- Remove IC: Once the solder has melted, remove the IC by lifting it with pliers.
- Power Off: After turning off the power switch, an automatic blowing function will begin, sending cool air through the pipe to cool both the heating element and the handle. Do not disconnect the plug during this cooling process.
- Disconnect Plug (Long Term): If the unit will not be used for a long time, disconnect the plug.
- Note: Approximately one minute after power off, the temperature will fall to 75°C (167°F), and the unit will automatically shut off.
- Remove Remaining Solder: After removing the IC, clean any remaining solder chips with a wick or desoldering tool.
- Note: For SOP, PLCC, etc., using tweezers with an iron is recommended for desoldering.
QFP Soldering:
- Apply Solder Paste: Apply the proper quantity of solder paste and flux (preferably no-clean) and place the SMD on the PCB.
- Preheat SMD.
- Soldering: Heat the lead frame evenly.
- Washing: After soldering is completed, wash the area with a defluxer.
- Note: While hot air SMD rework offers many advantages, defects can occur when soldering BGA. It is recommended to closely inspect all soldering joints.
Maintenance Features:
Replacing the Heating Element:
- Caution: Before replacing the heating element, ensure the unit is cool and unplug the power cord.
- Remove Screws and Slide Tube: Remove the 3 screws securing the handle and slide the cord tubing.
- Open Handle: Disconnect the ground wire sleeve and remove the outer tube assembly. Inside the tube, a quartz glass/heat insulation layer is installed; do not drop or damage it.
- Remove Heating Element: Disconnect the terminals and remove the old heating element.
- Insert New Heating Element: Handle the new heating element with care and avoid touching the wire leads. Insert the new heating element and reconnect the terminals. Reconnect the ground wire after replacing the element. Assemble the handle in the reverse order of disassembly.
Accessories:
The manual includes diagrams of various nozzles for different IC packages, such as QFP, PLCC, SOP, SOJ, and BGA, with their dimensions in millimeters and inches. These include:
- A1125B QFP 10x10
- A1126B QFP 14x14
- A1127B QFP 17.5x17.5
- A1128B QFP 14x20
- A1129B QFP 28x28
- A1135B PLCC 17.5x17.5 (44-pin)
- A1136B PLCC 20x20 (52-pin)
- A1137B PLCC 25x25 (68-pin)
- A1138B PLCC 30x30 (84-pin)
- A1139B PLCC 12.5x7.3 (18-pin)
- A1140B PLCC 11.5x11.5 (28-pin)
- A1141B PLCC 11.5x14 (32-pin)
- A1182B BQFP 24x24
- A1187B TSOL 18.5x8
- A1257B SOP 11x21
- A1258B SOP 7.6x12.7
- A1259B SOP 13x28
- A1260B SOP 8.6x18
- A1261B QFP 20x20
- A1262B QFP 12x12
- A1263B QFP 28x40
- A1264B QFP 40x40
- A1265B QFP 32x32
- A1124B Single Tube Ø2.5
- A1130 Single Tube Ø4.4
- A1131 SOP 4.4x10
- A1132 SOP 5.6x13
- A1133 SOP 7.5x15
- A1134 SOP 7.5x18
- A1142B Bent Single 1.5x3
- A1170 (Round Ø7)
- A1110 (Round Ø10)
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