SERVICE MANUAL
■ CONTENTS
SPECIFICATIONS.............................................................................. 3
PANEL LAYOUT ................................................................................. 4
CIRCUIT BOARD LAYOUT & WIRING .............................................. 6
BLOCK DIAGRAM ............................................................................. 8
DISASSEMBLY PROCEDURE .......................................................... 9
LSI PIN DESCRIPTION ................................................................... 13
IC BLOCK DIAGRAM....................................................................... 16
CIRCUIT BOARDS .......................................................................... 16
TEST PROGRAM ............................................................................ 25
DATA BACKUP & INITIALIZATION .................................................. 28
MIDI IMPLEMENTATION CHART .................................................... 29
OVERALL CIRCUIT DIAGRAM
PARTS LIST
This document is printed on chlorine free (ECF) paper with soy ink.
1.412K-976 Printed in Japan ’01.05
PK 001653
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