SERVICE MANUAL
■ CONTENTS
SPECIFICATIONS.............................................................................. 3
PANEL LAYOUT ................................................................................. 4
CIRCUIT BOARD LAYOUT & WIRING .............................................. 6
BLOCK DIAGRAM ............................................................................. 8
DISASSEMBLY PROCEDURE .......................................................... 9
LSI PIN DESCRIPTION ................................................................... 13
IC BLOCK DIAGRAM....................................................................... 18
CIRCUIT BOARDS .......................................................................... 19
TEST PROGRAM ............................................................................ 28
DATA BACKUP & INITIALIZATION .................................................. 32
ALERT MESSAGE LIST .................................................................. 33
MIDI IMPLEMENTATION CHART .................................................... 35
OVERALL CIRCUIT DIAGRAM
PARTS LISTThis document is printed on chlorine free (ECF) paper with soy ink.
1.412K-667 Printed in Japan ’01.05
PK 001654
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