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This document provides an operation manual for an ESD-Safe and Temperature Controlled Soldering Station.
This soldering station is designed for a wide range of desoldering and soldering operations on various components, including SOIC, CHIP, QFP, PLCC, BGA, and SMD. It is particularly well-suited for desoldering in-line sockets. Beyond soldering, the unit can also be used for heat shrinking, drying, paint removal, glue removal, defrosting, pre-heating, and glue soldering.
The device is designed for ease of use with several key operational features:
Basic Operation:
Temperature Display (°F/°C) Selection:
Digital Temperature Calibration: This feature allows correction of temperature discrepancies that may arise due to environmental changes or replacement of components like the heating element.
Nozzle Selection: The manual provides a detailed list of nozzle styles with their specifications and corresponding IC sizes, including QFP, PLCC, SOJ, BGA (CSP), TSOL, and SOP types, along with single-tube nozzles of various diameters. This allows users to select the most appropriate nozzle for specific tasks. When using nozzles smaller than standard machine nozzles, it is crucial to use maximum air volume with a relatively lower temperature setting and complete the operation in the shortest possible duration to avoid damaging the hot air gun.
General Maintenance & Precautions:
Troubleshooting:
Replacing the Heating Element:
| Brand | YIHUA |
|---|---|
| Model | 8858-I |
| Category | Soldering Gun |
| Language | English |
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