Chapter2SystemStructure
Figure2-2SoftwareArchitecture
Thelower-layersoftwaremodulesofboardsincludeBSP,DSP,andFPGA.
lBSP&OSmodule:initializesthesystemhardware,andprovidesdriverinterface
functionsandoperatingsystem.
lDSPmodule:exchangesinformationwiththeCPU,exchangescontrolsignalsand
datawiththeFPGAmodule,implementsmaintenanceandmeasurementfunctions
suchasextractingandupdatingpre-distortionparameters,anddetectingerrorsand
alarms.
lFPGAmodule:exchangescontrolsignalsanddatawiththeBSPandDSPmodules.
TheOperationSupportSub-system(OSS)isasupportlayerfortheentiresoftware.
Itprovidesahardwareirrelevantplatformonwhichthesystemsoftwarerunsto
providebasicsoftwarefunctions,suchasscheduling,timing,memorymanagement,
inter-modulecommunication,queuingcontrolling,monitoring,alarmmanagement,and
logmanagement.
TheOAMprovidesthefunctionsofversionmanagement,faultmanagement,diagnosis
test,congurationmanagement,toolmanagement,performancemanagement,system
management,dynamicdatamanagement,andcommunicationmanagement.
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SJ-20150104112914-001|2015-01-04(R1.0)ZTEProprietaryandCondential