Chapter 1 27
Hardware Specifications and Configurations
Processor
Second Level Cache
System Memory
Lan Interface
Wireless LAN
Pointing Device
Item Specification
Processor packing uFCPGA
Support Processor @ Launch ULV Centrino,PDC, ICPM, 10W CPU
On-die L2 Cache Up to 6 MB
FSB 1067 MHz
TDP (Thermal) 10W
Socket type BGA
Item Specification
North Bridge GS45
South Bridge ICH9M SFF
Item Specification
Technology DDR3 800/1067 MHz
Base momory DDR3 SO-DIMM x 1 slot (512)/1024/2048/4096MB DDR3
SDRAM
Expansion memory DDR3 SO-DIMM x 1 slot (512)/1024/2048/4096MB DDR3
SDRAM
Maximum memory size 8 GB ( Thermal evaluation based on 8 GB)
Item Specification
Controller (AVAP) Atheros AR8131
SPEED 10/100/1000Mb/s
Item Specification
Module Intel SP, 3rd 1x2 BGN/ Y
Interface Mini card (1)
Antenna 2
Item Specification
Glide Multi-touch touch PAD
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