SPEC NO.
M T1 8 5GW 0 1 V. 0
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D. Reliability test items
Test Item Test Condition Judgment Remark
High temperature storage
60°C, 240Hrs
Note 1 Note 2
Low temperature storage
-20°C, 240Hrs
Note 1 Note 2
High temperature & high
humidity operation
40°C, 90%RH, 240Hrs
(No condensation)
Note 1 Note 2
High temperature operation
50°C, 240Hrs
Note 1 Note 2
Low temperature operation
0°C, 240Hrs
Note 1 Note 2
Thermal Shock
(non-operation)
-20°C~60°C
1Hr, 1Hr, 100cycles
Note 1 Note 2
Electrostatic discharge (ESD)
(non-operation)
Contact:+/-8kV, 150pF(330ohms),
25 times/1 point, 1 time/1 sec
Air discharge:+/-15kV, 150pF(330ohms), 25
times/1 point, 1 time/1 sec
Note 1 Note 2
Vibration
(non-operation)
Vibration level : 1.5G
Bandwidth : 10-300Hz
Waveform : sine wave,
sweep rate : 10min
30 min for each direction X, Y, Z
(1.5 Hrs in total)
Note 1 Note 2
Mechanical Shock
(non-operation)
Shock level : 50G, 11ms
Waveform : Half sine wave
Direction : ±X, ±Y, ±Z
One time each direction
Note 1 Note 2
MTBF Demonstration 50,000 hours with confidence level 90% Note 1 Note 3
Note1: Pass: Normal display image with no obvious non-uniformity and no line defect.
Partial transformation of the module parts should be ignored.
Fail: No display image, obvious non-uniformity, or line defects.
Note2: Evaluation should be tested after storage at room temperature for one hour.
Note 3: The MTBF calculation is based on the assumption that the failure rate distribution meets the
Exponential Model (CCFL excluded)