R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory
Revision: B Rev Date: 12/21/2010
RIT SMFL Page 3 of 11
4.7 Wafer Field by Field Alignment – This method uses marks that are part of the CAD data
for each mask layer; they are not exposed individually. These marks may be placed in the
scribe lanes. Field by field alignment takes longer than global alignment because each die is
aligned.
4.8 Standard Jobs – Several standard jobs are available for use with the Standard Reticle
Templates. This allows a user to process wafers without having to develop a new stepper
job. These jobs should not be changed but may be copied and saved as new jobs.
5
SAFETY PRECAUTIONS
5.1 Hazards to the Operator
5.1.1 The ASML uses ultraviolet light as well as lasers, and should only be operated with
all of the covers closed. Safety glasses should be worn at all times.
5.1.2 The ASML stepper had mechanical hazards. Do not operate with open covers and
do not open any covers during operation.
5.2 Hazards to the Tool
5.2.1 Never open or service the wafer stage since serious damage to the tool can occur.
5.2.2 Never manually remove stuck wafers from the system. Please contact the tool
technician.
5.2.3 Reticle changing should only be done by a certified user. Use care not to touch the
surface of the reticle. If alignment marks become obscured, the stepper will not be
able to find them.
5.2.4 Do not remove the Combi reticle from the SMIF pod. It is fragile and expensive to
replace.
5.2.5 Wafers must have clean backs. This will keep the stage clean and prevent errors.
5.2.6 Do not remove a carrier that is not fully raised.
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