ASML PAS 5500 - Resetting the ASML Stepper System; Handling Errors During Stepper Run; Introducing Layer Shift in Stepper Job; Appropriate Uses of the ASML Stepper

R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 8 of 11
6.7 Resetting the System
6.7.1 To remove all wafers from the machine, select Batch Control from the Main
Menu, select Mat Hdl from the top of the screen and then 2 – Remove Wafers
from Machine. Never manually remove stuck wafers from the machine.
6.8 Errors during Run
6.8.1 If any errors occur contact the equipment engineer.
6.9 Introducing a Layer Shift
6.9.1 Select Process Data in your stepper job to enter a layer shift in microns. See
Section 6.8 of the ASML PASS 5500 Job Creation Manual.
7 APPROPRIATE USES OF THE TOOL
7.1 No backside coated wafers, only wafers with clean backs may be processed in this tool.
7.2 No polyimide or SU8 may be processed in this tool.
8 ATTACHMENTS
8.1 Dose to Clear Test (Exposure Matrix)
8.1.1 This test is done with or without a mask and the full field is exposed.
8.1.2 From the Main Menu select 6-Test Manager.
8.1.3 Select 1-Run Test.
8.1.4 Move to the top of the directory by clicking Up.
8.1.5 Select Illumination System.
8.1.6 Select Performance Tests.
8.1.7 Select Resist Uniformity.
8.1.8 Select Accept at the top of the screen.