2
English
1.2 Specications
Platform
•
Micro ATX Form Factor
•
All Solid Capacitor design
•
High Density Glass Fabric PCB
CPU
•
Supports 4
th
generation Intel® Core
TM
i7 / i5 / i3 / Xeon® /
Pentium® / Celeron® in LGA1150 package
•
Digi Power design
•
4 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
Chipset
•
Intel® B85
•
Supports Intel® Small Business Advantage 2.0
Memory
•
Dual Channel DDR3 Memory Technology
•
2 x DDR3 DIMM Slots
•
Supports DDR3 1600/1333/1066 non-ECC, un-buered
memory
•
Max. capacity of system memory: 16GB (see CAUTION)
•
Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
•
15μ Gold Contact in DIMM Slots
Expansion
Slot
•
1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
•
3 x PCI Express 2.0 x1 Slots
•
15μ Gold Contact in VGA PCIe Slot (PCIE1)
Graphics
•
Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
•
Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® HD Graphics 4400/4600
•
Pixel Shader 5.0, DirectX 11.1
•
Max. shared memory 1792MB
•
Dual graphics output: support DVI-D and D-Sub by
independent display controllers
•
Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
To Next Page