ASROCK P75 Pro3 - 1.2 Specifications

6
1.2 Specications
Platform - ATX Form Factor: 12.0-in x 7.0-in, 30.5 cm x 17.8 cm
- All Solid Capacitor design
CPU - Supports 3
rd
and 2
nd
Generation Intel
®
Core
TM
i7 / i5 / i3 in
LGA1155 Package
- Supports Intel
®
Turbo Boost 2.0 Technology
Chipset - Intel
®
B75
- Supports Intel
®
Small Business Advantage (see CAUTION 1)
- Supports Intel
®
Rapid Start Technology and Smart Connect
Technology
Memory - Dual Channel DDR3 Memory Technology
- 2 x DDR3 DIMM slots
- Supports DDR3 2200(OC)*/1600/1333/1066 non-ECC,
un-buffered memory (DDR3 1600 with Intel
®
Ivy Bridge
CPU, DDR3 1333 with Intel
®
Sandy Bridge CPU)
* DDR3 2200(OC) is only supported with Intel
®
Core
TM
i7
3770K
- Max. capacity of system memory: 16GB (see CAUTION 2)
- Supports Intel
®
Extreme Memory Prole (XMP)1.3/1.2
Expansion Slot - 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
* PCIE 3.0 is only supported with Intel
®
Ivy Bridge CPU. With
Intel
®
Sandy Bridge CPU, it only supports PCIE 2.0.
- 1 x PCI Express 2.0 x16 slot (PCIE3: x4 mode)
- 2 x PCI Express 2.0 x1 slots
- 2 x PCI slots
- Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
Audio - 7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH audio, please use an HD front panel
audio module and enable the multi-channel audio feature
through the audio driver.
LAN - PCIE x1 Gigabit LAN 10/100/1000 Mb/s
- Realtek RTL8111E
- Supports Wake-On-LAN
- Supports LAN Cable Detection
- Supports Energy Efcient Ethernet 802.3az
- Supports PXE
Rear Panel I/O I/O Panel
- 1 x PS/2 Mouse/Keyboard Port
- 1 x Parallel Port (ECP/EPP Support)
- 1 x Serial Port: COM1