2
English
1.2 Specications
Platform
•Micro ATX Form Factor
•Solid Capacitor design
CPU
•Supports 6
th
Generation Intel® Core
TM
i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
•Digi Power design
•6 Power Phase design
•Supports Intel® Turbo Boost 2.0 Technology
Chipset
•Intel® B150
•Supports Intel® Small Business Advantage 4.0
Memory
•Dual Channel DDR4/DDR3/DDR3L Memory Technology
•2 x DDR4 DIMM Slots
•Supports DDR4 2133 non-ECC, un-buered memory
•Max. capacity of system memory: 32GB
•Supports Intel® Extreme Memory Prole (XMP) 2.0
•15 Gold Contact in DDR4 DIMM Slots
•2 x DDR3/DDR3L DIMM Slots
•Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-buered memory
•Max. capacity of system memory: 32GB
•Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
* DDR4 and DDR3/DDR3L memory can not be used
simultaneously.
Expansion
Slot
•2 x PCI Express 3.0 x16 Slots (PCIE1: x16 mode; PCIE3: x4
mode)
•1 x PCI Express 3.0 x1 Slot (Flexible PCIe)
•Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
•15 Gold Contact in VGA PCIe Slot (PCIE1)